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TRR 196:  Mobile Material Characterization and Localization by Electromagnetic Sensing

Subject Area Computer Science, Systems and Electrical Engineering
Physics
Term since 2017
Website Homepage
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 287022738
 
More than 100 years ago, scientists invented a Mobile Image Receiver to take pictures anywhere. More than 30 years ago, engineers invented a Mobile Communication Transceiver to make phone calls any-where. Nearly 8 years ago, we at the Collaborative Research Center MARIE began investigating a Mo-bile MAteRIal TranscEiver to map surface and subsurface materials anywhere. Next, in the final phase, we want to achieve the vision of Mapping Materials for Dynamic Environments. All of the necessary breakthrough inventions are based on major technological advances that allow us to move successively from electronic, photonic, and micromechanical components via integrated circuits to compact mobile devices. Following these stages, we aim to greatly expand the benefits of today's static and bulky material characterization systems into mobile material transceivers. This will lead to significant innovations in a wide range of societal applications: mobile detection of the source of a fire or unconscious people in a burning building, fast detection of cables and artifacts inside a wall, or, in general, autonomous creation of material maps, e.g. for localizing and classifying objects in arbitrary indoor and outdoor environments. MARIE's sensing frequency ranges from 250 GHz (from 1st phase) to 5 THz (from 2nd phase) and in the 3rd phase to 6 THz, allowing it to cover a wide variety of materials and provide extremely high-resolution material maps due to the enormous bandwidth available. In the 1st and 2nd phases of MARIE, four major research challenges were broadly addressed: the thorough measurement, analysis, and modeling of THz wave propagation; the compact realization of THz transceivers; the static and mobile characterization of surface and subsurface materials; and the precise localization of such materials. Now, in the 3rd phase, which focuses on the fundamental research needed to achieve the MARIE vision, the four broad "Grand Challenges" are evolving into three large, highly collaborative "Lead Projects", namely Localization, Imaging, and Mapping. These are vertically structured and verified by experiments, modeling and simulations in the various MARIE laboratories. To complement the vertical lead projects, MARIE is further organized into three horizontal structured main research areas: first, Chips from technology (C) aims at the realization of a novel dynamic transceiver technology to provide integrated circuits; second, Models from measurements (M) aims at deriving new models for dynamic material characterization and localization from extensive measurement campaigns; and third, Systems from concepts (S) investigates key signal processing concepts under technological and real-time constraints to design real-time material mapping systems. Enriched with all this know-how, the 3rd Dynamic Environment Phase makes rapid real-time material mapping mandatory to ultimately achieve the vision of the Mobile MAteRIal TranscEiver in 2028.
DFG Programme CRC/Transregios

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Applicant Institution Universität Duisburg-Essen
Co-Applicant Institution Ruhr-Universität Bochum
 
 

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