Capacitive and ohmic microelectromechanical switches with bridges made of spring stell, especially for application in high frequency systems
Subject Area
Microsystems
Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term
from 2013 to 2016
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 233756290
The scientific programm of this proposal embraces design, development, optimization and characterization of electrostatically activated capacitive and ohmic microelectromechanical switches (MEMS-switch) by use of spring steel for the bridges of the switches. These bridges will be fabricated in a monolithic way by sputtering of sprong steel and in a hybrid way by bonding of pre-structured spring steel foils to a substrate. For both approaches, the capacitive and ohmic MEMS-bridges will be modified by application of additional electrical and thermaly highly conductive metal films. At least for the monlithic approach, MEMS-bridges consisting of three parts, a spring part (made of spring steel), a contact part (made of Silver, e.g.) and a second spring part (made of spring steel) will be investigated and characterized.These MEMS-swithces will be applied to tunable and reconfigurable microwave filter and antenna structures.
DFG Programme
Research Grants
