Project Details
Projekt
MiMoSe - Microelectronic modular system for sensor-integrating machine elements
Applicants
Professor Dr.-Ing. Eckhard A. Kirchner; Professor Dr.-Ing. Dieter Krause; Professor Dr.-Ing. Hoc Khiem Trieu
Subject Area
Engineering Design, Machine Elements, Product Development
Microsystems
Microsystems
Term
since 2021
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 466493340
The systematic development of sensor-integrating machine elements (SiME), in particular taking into account the severely limited installation space, efficient data management and a self-sufficient energy budget, represents a significant challenge in the field of mechatronic development that is currently not sufficiently supported methodologically. The aim of this project is to design and test a model-based microelectronic modular system for the systematic development of sensor systems in SiME, using the example of fixing and motion screws, in order to be able to configure and predefine application-specific sensor systems from electronic modules. This is to be achieved through the necessary collaboration between the different areas of mechanics, (micro-) electronics, software and design methodology.At the beginning, mechanical, electrical and geometrical requirements for sensor systems in sensor-integrating fixing and motion screws are identified. These are implemented in a requirements model in the modelling language SysML as the basis for the model-based microelectronic modular system. Subsequently, the product characteristics necessary to fulfil the requirements are determined. Available microelectronic components are subsequently identified, analysed with regard to their properties and a suitable structure for their classification is developed. The components are modelled in SysML with the associated dependencies and the necessary parameters for configuration and predesign as a microelectronic modular system. This type of modelling makes it possible to store different types of data elements and allows a simple consistency check in the case of later adjustments as well as the extension of the microelectronic modular system. If the modular structure is transferred to a suitable configuration system, it allows the application-specific combination of module variants and the configuration of different solution alternatives for sensor systems in SiME. This is done taking into account the respective requirements from the measurement task and the individual application and boundary conditions of the machine element. The system configuration and design is based on three newly defined basic strategies: optimised for data-, energy- or installation space. Two sensor systems are selected as examples for prototypical implementation in the form of demonstrators. For an initial verification of the model based modular system and the configuration system, the prototypically realised sensor system demonstrators will each be integrated into a fixing and a motion screw. Finally, the realised SiME prototypes will be experimentally examined in static and dynamic tests to enable a comparison between the measured and predicted signals and application limits of the sensor systems.
DFG Programme
Priority Programmes
