Aluminum-copper bond wires for power electronic modules

• Applicant: Privatdozent Dr.-Ing. Sören Müller
• Subject Area: Primary Shaping and Reshaping Technology, Additive Manufacturing ; Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering ; Materials in Sintering Processes and Generative Manufacturing Processes
• Term: from 2020 to 2023
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 440974394

The described research project is dealing with the development of a suitable process chain for the production of aluminum-copper bond wire. Furthermore, the produced compound wires will be characterized regarding their mechanical and electrical properties as well as their bonding behavior. After the successful development the Al/Cu compound wires will be implemented in a demonstrator setup for the serial production of power electronic modules.

• DFG Programme: Research Grants (Transfer Project)
• Application Partner: Hesse GmbH; Vitesco Technologies GmbH; Standort Nürnberg
• Cooperation Partner: Professor Dr.-Ing. Martin Schneider-Ramelow