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Multicast chip-to-chip interconnect based on millimeter-wave dielectric waveguide

Subject Area Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
Term from 2018 to 2020
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 408428878
 
Final Report Year 2020

Final Report Abstract

High data-rate inter-chip / intra-chip communication is required for modern computer systems. As an alternative to conventional approaches, which are based on metal transmission lines, and to wireless systems, the project investigated dielectric waveguide-based millimeter-wave interconnects for short distances. Important building blocks were designed and experimentally evaluated. These include low-loss transitions with power-split functionality, from on-chip lines to dielectric waveguide with about 2 dB loss at 180 GHz. Experiments showed that end-to-end transmission loss of the interconnect is very low compared to alternative approaches. In addition, high-efficiency on-chip antennas (operating at 180 GHz) and low-loss narrowband on-chip band-pass filters (operating at 170 GHz) were demonstrated in this project. Alternative applications of the technology, such as for dielectric characterization of liquids and for tunable filters, were explored.

 
 

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