Photonic integrated THz image sensor (C07)

• Subject Area: Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering
• Term: since 2017
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 287022738

In the 3rd phase C07 combines individual, photonic integrated circuit (PIC)-based lasers, photonic transmitter arrays and receiver arrays towards a hybrid integrated photonic THz system for in-door imaging using two-dimensional beam steering in a mobile scenario and dynamic environment. This will be the world’s first miniaturized mobile photonic integrated circuit (PIC)-based THz imaging system, including the optical beam forming network. Besides imaging at a distance of a few meters, targeted applications include contactless life-sign detection in hazardous environments, spectroscopy and material localization jointly with C06, as well as photonic synthetic aperture radar (SAR) imaging in collaboration with M05.

• DFG Programme: CRC/Transregios
• Subproject of: TRR 196: Mobile Material Characterization and Localization by Electromagnetic Sensing
• Applicant Institution: Universität Duisburg-Essen
• Project Heads: Professor Dr. Martin Hofmann; Professor Dr. Sascha Preu; Professor Dr.-Ing. Andreas Stöhr