Extrusion of electrically conductive, thermoplastic films and ultrasonic embossing to electronic circuits

• Applicants: Professor Dr.-Ing. Christian Hopmann; Professor Dr. Werner K. Schomburg
• Subject Area: Microsystems ; Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering ; Plastics Engineering
• Term: from 2015 to 2019
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 272137833

Aim of the project, is the creation of knowledge in the field of compounding and extrusion of electrically conductive thermoplastics. By that, films with an adjustable conductivity are producible. These films can be used to produce circuit boards with mounted SMD via ultrasonic embossing. The SMD are integrated during the embossing process itself. Hence, the production process is leaner. Additionally, the sustainability is improved, since corrosive chemical waste is avoided and solder is not necessary anymore.

• DFG Programme: Research Grants