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SPP 1796:  High Frequency Flexible Bendable Electronics for Wireless Communication Systems (FFLexCom)

Subject Area Computer Science, Systems and Electrical Engineering
Materials Science and Engineering
Physics
Thermal Engineering/Process Engineering
Term from 2015 to 2023
Project identifier Deutsche Forschungsgemeinschaft (DFG) - Project number 255449811
 
In the past, electronic devices have mainly been advanced regarding performance, power consumption and costs. A further interesting property of future electronics is mechanical flexibility, which can come together with advantageous features such as bendability, stretchability, light weight, ultra-thinness, transparency, large area integration and easy recyclability. These properties can be achieved by modern TOLAE (thin film organic and large area electronics) technologies.Cut-off frequencies up to the MHz range and bending radii down to 3 mm were reported for TOLAE devices such as transistors. These recent achievements indicate a totally novel and promising research area: Wireless communication systems fully integrated on ultra-thin, bendable and flexible substrates such as plastic or even paper. In this regard, the FFlexCom priority programme wants to pave the way for the first circuits and systems for wireless communications, which are fully integrated in flexible TOLAE technologies. However, to enable functional flexible systems and sufficiently high operation frequencies for wireless communications, the speed of flexible TOLAE devices and circuits must be massively increased.
DFG Programme Priority Programmes
International Connection Finland, United Kingdom, USA

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