Reactivity, Energetics and Structure of Buried Organic/Metal Interfaces
(A04)
Subject Area
Physical Chemistry of Solids and Surfaces, Material Characterisation
Term
since 2013
Project identifier
Deutsche Forschungsgemeinschaft (DFG) - Project number 223848855
Chemical bonding and reactivity at organic/metal interfaces are investigated using model systems for organic semiconductors (OSCs) and organic electrode materials (OEMs). Two main aspects are addressed: First, the role of molecular topology for the interfacial bond will be clarified by comparison of nonalternant electron systems with their alternant isomers. Second, the chemical nature of reac¬ted interlayers (interphases) between alkali metals and OEMs will be investigated. The structural, electronic, chemical, energetic, and kinetic aspects of interface/interphase formation will be studied with multiple techniques including HAXPES, NEXAFS, UPS, TPD/TPR, STM, NIXSW, and others.
DFG Programme
Collaborative Research Centres
