Fundamental Study and Pragmatic Enhancement of Single Point Diamond Turning through Embedded Thin Film Sensor Arrays

• Applicant: Professor Dr.-Ing. Eckart Uhlmann
• Subject Area: Metal-Cutting and Abrasive Manufacturing Engineering ; Production Automation and Assembly Technology
• Term: from 2013 to 2018
• Project identifier: Deutsche Forschungsgemeinschaft (DFG) - Project number 233422078

Ultra-precision machining with diamond tools is increasingly being used for various manufacturing operations over a wide spectrum of applications with mainly optical background ranging from semiconductor devices, medical components to laser technology. This international collaborative research project will introduce new temperature and force measurement technology to ultra-precision operations. These sensors will be embedded into diamond tools and produced by thin film technologies; they will be only a few microns in size and located in the direct vicinity of the cutting edge zone. Providing response times in the sub-millisecond range, the sensors will allow new insights into the thermo-chemical and thermo-mechanical process of ultra-precision cutting. Applying these new embedded sensors, the IWF will focus on the investigation of the thermo-chemical wear behavior of three different diamond materials and the introduction of new monitoring and control schemes to avoid wear based on measurements with micro embedded thin film temperature and force sensors.

• DFG Programme: Research Grants
• International Connection: USA
• Participating Persons: Professor Dr. Kornel F. Ehmann; Professor Xiaochun Li; Professor Dr.-Ing. Dirk Oberschmidt